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2.4GHz SiGe,
High IP3 Low-Noise Amplifier
Table 1. MAX2644 Typical Scattering Parameters
(R BIAS = 750 ? , V CC = +3.0V, T A = +25°C.)
FREQ.
(MHz)
2200
2250
2300
2350
2400
2450
2500
2550
2600
2650
2700
S11
MAG
0.3372
0.3098
0.3283
0.4005
0.4839
0.5443
0.5758
0.5784
0.5698
0.5600
0.5533
S11 PHASE
(DEGREES)
-79.36
-70.09
-57.20
-50.46
-50.28
-56.33
-60.09
-63.61
-66.56
-68.51
-69.86
S21
MAG
5.1940
5.3156
5.4281
5.4175
5.3346
5.0687
4.9556
4.5952
4.2364
4.1376
4.0729
S21 PHASE
(DEGREES)
170.97
166.79
159.22
150.70
143.93
136.45
132.16
127.68
126.58
126.51
120.60
S12
MAG
0.0414
0.0445
0.0469
0.0441
0.0349
0.0233
0.0113
0.0041
0.0063
0.0103
0.0133
S12 PHASE
(DEGREES)
157.19
146.70
130.62
108.72
85.67
58.80
27.74
-38.98
-110.49
-128.93
-140.21
S22
MAG
0.2818
0.2204
0.1566
0.1480
0.2795
0.4179
0.5135
0.5622
0.5986
0.6208
0.6425
S22 PHASE
(DEGREES)
-73.71
-67.13
-50.26
-3.96
15.12
11.12
3.28
-2.66
-7.45
-10.43
-12.93
Table 2. MAX2644 Typical Scattering Parameters
(R BIAS = 1.2k ? , V CC = +3.0V, T A = +25 ° C.)
FREQ.
(MHz)
2200
2250
2300
2350
2400
2450
2500
2550
2600
2650
2700
S11
MAG
0.3482
0.3121
0.3051
0.3693
0.4769
0.5619
0.5948
0.5939
0.5825
0.5708
0.5604
S11 PHASE
(DEGREES)
-67.06
-58.60
-43.64
-30.34
-29.48
-35.54
-42.64
-47.58
-50.94
-53.14
-54.35
S21
MAG
5.2390
5.3790
5.5982
5.8137
5.8063
5.6624
5.3015
4.7813
4.3271
4.1961
4.1068
S21 PHASE
(DEGREES)
-177.33
178.72
173.43
166.48
158.29
150.06
142.37
136.67
134.58
133.48
128.01
S12
MAG
0.0402
0.0435
0.0452
0.0427
0.0341
0.0236
0.0117
0.0034
0.0056
0.0096
0.0125
S12 PHASE
(DEGREES)
161.53
151.97
136.90
116.57
95.13
68.36
41.34
-13.74
-104.09
-124.80
-134.75
S22
MAG
0.2873
0.2305
0.1735
0.1582
0.2687
0.4043
0.5030
0.5602
0.5952
0.6215
0.6434
S22 PHASE
(DEGREES)
-76.58
-69.42
-54.22
-16.42
6.52
5.00
-2.19
-8.04
-12.76
-15.97
-18.83
Standby
Standby mode is achieved by disconnecting BIAS as
shown in Figure 1. Avoid capacitance at the BIAS pin
by connecting the bias resistor from BIAS to the switch.
Layout Issues
A properly designed PC board is essential to any
RF/microwave circuit. Use controlled impedance lines
on all high-frequency inputs and outputs. Bypass with
decoupling capacitors located close to the device V CC
pin. For long V CC lines, it may be necessary to add
additional decoupling capacitors. These additional
capacitors can be located farther away from the device
package. Proper grounding of the GND pins is essen-
tial. If the PC board uses a topside RF ground, connect
it directly to all GND pins. For a board where the
ground plane is not on the component layer, the best
technique is to connect the GND pins to the board with
a plated through-hole located close to the package.
6
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